| 摘要 |
PROBLEM TO BE SOLVED: To provide a package semiconductor device which is small-sized and thin and at the same time, can be easily made a test of operation and is easy in a 3D modularization using a lamination. SOLUTION: A semiconductor device has a semiconductor component 1, a plurality of leads 2 provided in close vicinity to the side directions of the component 1, bonding wires 3 and a sealing resin 4. The device is constituted into a structure that the upper surface of each lead 2 has an upper surface upper step part 2a and an upper surface lower step part 2b lower than that part 2a, the thickness of the lead in each part 2a is thicker than that of the component 1, the wires 3 are bonded to the parts 2b and electrode pads formed on the surface of the component 1, the upper surface of the resin 4 forms the same plane with the parts 2a of the leads 2 and the parts 2a of the leads 2 are exposed, the lower surface of the resin 4 forms the same plane with the lower surfaces 2c of the leads 2 and the rear of the component 1, and the lower surfaces 2c of the leads 2 and the rear of the component 1 are exposed.
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