| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate assembly that can realize a substrate-to- substrate conducting method, by which the thickness and size of a device can be reduced also. SOLUTION: A routing substrate has a processor section, which operates as a routing management section or routing accelerator, when a dip switch is turned on or off. In addition, the routing substrate is provided with a simultaneous bidirectional transmission circuit, which simultaneously performs bidirectional communication through one transmission line. Routing substrates having the same circuit are conducted through a press-fit type connection terminal 55.
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