| 摘要 |
PROBLEM TO BE SOLVED: To provide a package having a high reliability in sealing. SOLUTION: The package for housing an electronic component consists of the main body 1 and a metal cover body 2. The main body 1 of the package includes a mounting section 4 for mounting an electronic component 3 and a ceramic frame body 6 surrounding the mounting section 4, which are disposed on the upper surface of a nearly flat substrate 5, and a metallized layer 9 for sealing which is attached to the upper surface of the ceramic frame body 6. The metal cover body 2 is welded to the metallized layer 9 through a solder material 10. The ceramic frame body 6 is formed with a rounded part 11 having a radius of about 5 to 50 mm from the upper surface toward the outer side face. The periphery of the metallized layer 9 is extended to the middle of the rounded part 11. After welding the metal cover body 2 to the metallized layer 9, residual stress pulling the periphery of the metallized layer 9 inwards is distributed by the rounded part 11, effectively preventing the metallized layer 9 from peeling.
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