METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To locate and adjust a potting nozzle precisely in a short time. SOLUTION: After a resin 8 is applied to an application face 1 from a nozzle 2 in potting equipment which seals a semiconductor element with a potting resin, the nozzle 2 is lowered further to make its tip sink into the resin 8 on the application face 7, thereby forming a recess 14, which reflects the shape of the tip of the nozzle 2. The position of the nozzle center 11 of the nozzle 2 is detected accurately with a camera image 15, on the basis of an image of the recess 14 in the resin 8.