WAFER FOR EVALUATION OF METAL CONTAMINATION AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To evaluate a Cu contamination quantitatively without using an expensive measuring device. SOLUTION: A test wafer with a a-Si film 3 formed on a Si wafer 1 through a SiN film 2 is used for the evaluation. The Cu contamination is quantitatively evaluated by a degree of surface roughness of the a-Si film 3 of the test wafer.