| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which has high manufacturing yield and an electronic device wherein it is used by restraining excess interface reaction when a chip part, especially an IC chip substrate, is fixed to a mounting member consisting of a resin material by means of a brazing material bump, and preventing breakage of a brazing part caused by thermal and mechanical change during manufacturing or operation. SOLUTION: In a semiconductor device, a semiconductor substrate is fixed on a mounting member consisting of a resin material provided with a conductor wiring in a surface by a bump which is constituted of a brazing material comprising Sn, or a brazing material comprising two or more kinds of substances selected from a group of Sn, Sb, Ag, Cu, Ni, P, Bi, Zn, Au and In. The semiconductor substrate, the bump and the mounting member are molded from thermosetting resin. |
