发明名称 MICRO INTERCONNECTION CIRCUIT DEVICE AT ORIGINAL POSITION AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for interconnection at the original position whereby nano-wires are grown and formed at the original position on each of circuit boards to create a structure of the interconnected nano-wires on each circuit board. SOLUTION: Two parallel circuit boards 10, 10' are disposed with a fixed space (g), and catalyst nucleus forming layer 26 for selectively growing the nano-wires 14 are provided on pad surfaces with contact pads 12a, 12a' facing those 12b, 12b'. The nano-wires 14 grow to the mutually opposite sides to attain the interconnection at the original position.
申请公布号 JP2001177052(A) 申请公布日期 2001.06.29
申请号 JP20000325116 申请日期 2000.10.25
申请人 LUCENT TECHNOL INC 发明人 WALTER L BROWN;JIN SUNGHO;ZHU WEI
分类号 H01L25/18;H01L21/98;H01L23/498;H01L23/52;H01L23/538;H01L25/065;H01L25/07;H01L29/06 主分类号 H01L25/18
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