| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for press bonding electronic components to improve productivity by shortening the tact time. SOLUTION: This method for press bonding an electronic component to press bond the component 5 on a board 3 through press bonding head 6 comprises the steps of advancing, prior to press bonding, an optical head 11 to a space between the component 5 and the board 3 by a moving table 13, and detecting a plurality of one-dimensional images by a CCD camera 17 for scanning the head 11. The method further comprises the steps of acquiring two-dimensional images of the board 3 and the component 5 by an image recognition unit 12 based on the one-dimensional images, and recognizing the board 3 and the component 5 by the obtained two-dimensional images. Thus, the time required for imaging can be shortened, except for the stationary time of the head 11 when recognized.
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