CLEANING AND PROCESSING METHOD OF SUBSTRATE, AND APPARATUS THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a cleaning and processing method of a semiconductor wafer, whereby not only its front and rear surfaces but also its outer peripheral surface can be cleaned. SOLUTION: This cleaning and processing method of a semiconductor wafer 10 has a process for holding the semiconductor wafer 10 and rotating it in the circumferential direction, a process for contacting respectively the end surfaces of a pair of cleaning brushes 37 with its front and rear surfaces and driving the cleaning brushes 37 along its diametrical direction to clean its front and rear surfaces, and a process for cleaning thereafter its outer peripheral surface by at least one of the outer peripheral surfaces of the pair of cleaning brushes 37.