| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for an electronic component of a structure that the cracking in an electronic component is prevented and heat which is generated in the actuation of the component is favorably dissipated to the outside. SOLUTION: A metal plate 10 for heat dissipation is bonded to a package body 20 and thereafter, a solder paste is printed on the lower surface of the plate 10 and a reflow treatment is performed to form a solder layer 90. Therefore, even though a warpage is generated in the plate 10, the layer 90 is deformed by an external force at the point when a fin 60 for heat dissipation is mounted on the side of the lower surface of the plate 10 to reduce a distortion which is generated in a package 100 for a semiconductor material made of ceramics, and a crack is prevented from being generated in the package body 20 and a semiconductor component 30. Moreover, the layer 90 is deformed to closely adhere to the fin 60, whereby a heat resistance between the element 30 and the fin 60 is reduced. Accordingly, heat which is generated in the actuation of the semiconductor component 30 is favorably dissipated to the outside and the semiconductor component 30 can be actuated normally and stably for a long period. |
