| 摘要 |
PROBLEM TO BE SOLVED: To provide wiring board and electronic component with lead pins, with which a lead pin can be bonded with a favorable strength even to a wiring board using an insulating substrate with unfavorable heat resistance. SOLUTION: This electronic component is equipped with an insulating substrate, a plurality of wiring conductors 9, 10 formed on a surface of the insulating substrate and/or inside thereof, a land 12 formed on a lower surface of the insulating substrate and a lead pin 5 whose head portion 5a is soldered to the land 12. The lead pin 5 is provided with a C surface and an R surface in the periphery 5c of the head portion 5a on the head top side. The Young's modulus of a shaft portion 5b is 30-80 GPa. Even when a brazing filler material 14 having a low melting point is used for the wiring board 4 having unfavorable heat resistance, a favorable bonding strength equal to a stretch in a perpendicular direction is obtained for a stretch of the lead pin 5 in an oblique direction. |
