| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component that can contribute to further miniaturization of an electronic device by increasing the mount density on a printed circuit board. SOLUTION: One a side 10 of a substrate 1 is formed flat. Each of terminal electrodes 21, 22 is formed only within a face of the one side 10 of the substrate 1. The terminal electrode 21 is parted by a gap g11 from one end edge of the substrate 1 in the length direction X and parted by gaps g21, g22 from both end edges in the width direction Y. The terminal electrode 22 is separated by a gap g12 from one end edge of the substrate 1 in the length direction X and parted by the gaps g21, g22 from both end edges in the width direction Y.
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