| 摘要 |
PROBLEM TO BE SOLVED: To efficiently mount a highly integrated module, easily coping with the improved function of an already working device, and exchange and maintain an individual fan that is prepared for the highly integrated module without scarifying the functions of the device. SOLUTION: High heat generation and highly integrated printed circuit boards 7 and 8 are subjected to parallel packaging with high packaging efficiency, and a fan 15 with movable structure is composed as a thermally closed unit 6, along with a fan unit 14 in withdrawal structure with an accommodation-type roof 16, thus locally cooling the electronic equipment device.
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