| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flexible printed-wiring board whose heat resistance, break resistance and dimensional stability are superior and whose warping is not generated, by a method wherein a wiring board is coated with a heat-resistant resin solution so as to be dried and to obtain is manufacturing method. SOLUTION: The wiring board in which a conductor circuit is formed on a base material composed of a polyimide, and/or a polyimide film is coated with the heat-resistant resin solution as a polyimide and/or a polyamideimide soluble in an organic solvent and dried. It is wound and heat-treated, and a heat-resistant resin layer is formed.
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