| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction method of a semiconductor chip which can perform safe junction even for a substrate which is sensitive to heat such as a tape substrate, and a device thereof by allowing resin to completely come into a space between a semiconductor chip and a substrate, by supplying resin before junction and jointing a substrate and a semiconductor chip while applying ultrasonic vibration from above resin without using a heating mechanism. SOLUTION: This invention adopts following means; (1) resin covering a lower surface of a semiconductor chip to be jointed to at least a semiconductor junction part of a wiring electrode on a substrate is supplied, (2) a wiring electrode and a semiconductor chip to be jointed are positioned, (3) a semiconductor chip is put close to a semiconductor junction part of a wiring electrode from above resin, and at least when a semiconductor chip comes into actual contact with resin, a semiconductor chip is pressed to a substrate at a specified pressure while applying ultrasonic vibration to a semiconductor chip.
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