发明名称 |
OPTICAL COMMUNICATION MODULE PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To provide a package which does not deteriorate sealing property and optical coupling even if a material of a large thermal conductivity is used for a bottom plate because of the requirement for a large heat radiation property for the package, resulting in the use of materials having a large difference in a coefficient of linear expansion for the bottom plate and side plates. SOLUTION: The bottom plate 2 and the side plates 1 of the package are formed in a joint part with tenons 3. The bottom plate 2 and the side pleats 1 are joined to each other by engaging these tenons 3. The width of each tenon 3 is preferably between 1 mm and 5 mm. |
申请公布号 |
JP2001176998(A) |
申请公布日期 |
2001.06.29 |
申请号 |
JP20000279755 |
申请日期 |
2000.09.14 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
OE SATOSHI |
分类号 |
G02B6/42;H01L23/04;H01L31/02;H01L33/48;H05K5/02 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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