发明名称 OPTICAL COMMUNICATION MODULE PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a package which does not deteriorate sealing property and optical coupling even if a material of a large thermal conductivity is used for a bottom plate because of the requirement for a large heat radiation property for the package, resulting in the use of materials having a large difference in a coefficient of linear expansion for the bottom plate and side plates. SOLUTION: The bottom plate 2 and the side plates 1 of the package are formed in a joint part with tenons 3. The bottom plate 2 and the side pleats 1 are joined to each other by engaging these tenons 3. The width of each tenon 3 is preferably between 1 mm and 5 mm.
申请公布号 JP2001176998(A) 申请公布日期 2001.06.29
申请号 JP20000279755 申请日期 2000.09.14
申请人 SUMITOMO ELECTRIC IND LTD 发明人 OE SATOSHI
分类号 G02B6/42;H01L23/04;H01L31/02;H01L33/48;H05K5/02 主分类号 G02B6/42
代理机构 代理人
主权项
地址