| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive element, a method for producing a resist pattern and a method for producing a printed wiring board. SOLUTION: In the photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator, the component B has (b1) a bisphenol A type (meth)acrylate compound, (b2) a polypropylene glycol diacrylate and (b3) a phenoxypolyethyleneoxy (meth) acrylate compound as essential components. The photosensitive resin composition is applied on a substrate, dried and laminated, the resulting photosensitive element is laminated on a substrate for circuit formation in a contact state and imagewise irradiated with active light, the exposed part is photo-cured and the unexposed part is removed by development to produce the resist pattern. The substrate with the produced resist pattern is etched or plated to produce the printed wiring board. |
