| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for plating a lead frame partially, which can prevent unnecessary increase in lead frame manufacturing costs as well as malfunction of a semiconductor device using a lead frame. SOLUTION: With this method of plating a lead frame partially, a gas flowing from a masking jig 10 towards a portion lm to be plated between respective leads l of a lead frame F so that infiltration of a plating solution between the respective leads l in the masking jig 10 is prevented. In this apparatus 1 for plating a lead frame partially, the masking jig 10 has a gas supplying passage 10P connected to an air blower 30 (gas supply means), so that a gas is supplied between the leads l of the lead frame F. Infiltration of the plating solution between the leads l in the masking jig 10 is prevented by allowing the gas from a gas supply port 10o to flow towards the portion lm to be plated.
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