MANUFACTUREING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To evaluate positioning accuracy of a chip and a tape after flip-chip bonding highly precisely. SOLUTION: A prism-type mirror 2 which can back and a camera 1 for sensing image, etc., of a pad of a chip 3 and a bump 4b of a tape 4 reflected in two reflection surfaces 2b, 2c of the prism-type mirror 2 are arranged between a mount head 5 holding the chip 3 and the tape 4 on a stage. Consequently misregistration amount of a pad of the chip 3 and the bump 4b of the tape 4 immediately before bonding is measured accurately, and defective or non- defective of misregistration of a pad and the bump 4b after completion of flip- chip bonding is judged highly precisely.