| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer interconnection board superior in heat- resistance. SOLUTION: An insulating layer is formed is formed on an inner-layer circuit board, over which an outer-layer circuit is formed. A character, number, and mark of conductor are comprised on the surface of inner-layer circuit board, with an independent void in the character, number, and mark being filled with a conductor, or an independent void provided by cutting off a part of the charter, number, and a mark communicated with a surrounding part comprising no conductor. |
