COPPER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND LIQUID CRYSTAL DISPLAY

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper wiring substrate, capable of promoting an insulating characteristic of an upper film by enhancing planarity on a wiring surface. SOLUTION: The method for manufacturing the copper wiring substrate comprises a step for forming a gate electrode 3 and a gate wire 19 (copper wire) on the substrate, a step for nitriding the surface of the copper wiring to form a copper nitride layer 4 by exposing the substrate into ammonia gas atmosphere or ammonia gas plasma, and a step for forming a gate insulating film 5 constituted of a silicon nitride film on the surface of the copper nitride film. The nitride treatment may be substituted for the reduction process or a forming process of a silicon insulating film with a small ratio of a silicon atom percentage content on the surface of the copper wiring.