发明名称 MANUFACTURING METHOD FOR PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed wiring board for shortening working time and superior productivity. SOLUTION: A resin-fitted metal foil is stacked on an innerlayer circuit board comprising an innerlayer circuit, which is heated and pressurized for a laminate, and a hole reaching the innerlayer is opened so that the innerlayer and the metal foil is electrically connected, and then the metal foil is worked to form an outer-layer circuit. Here, at opening the hole reaching the innerlayer, a metal foil of 1-5μm in thickness is used and the metal foil side of laminated board comprising a resin and the metal foil is irradiated with laser.
申请公布号 JP2001177246(A) 申请公布日期 2001.06.29
申请号 JP19990362028 申请日期 1999.12.21
申请人 HITACHI CHEM CO LTD 发明人 TSUYAMA KOICHI;HAMA YASUHIKO
分类号 H05K3/00;H05K3/26;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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