发明名称 MANUFACTURING METHOD OF PRINTED-WIRING BOARD HAVING THIN BOARD THICKNESS
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method that prevents damages caused by strength shortage of a working board, in the manufacture of a printed-wiring board that has thin board thickness and does not contain glass fiber. SOLUTION: This printed-wiring board is manufactured by a working board, where a reinforcing plate 3 in a shape where a printed-wiring board product part is eliminated, is held between two pieces of copper foil 2 with resin 1 for laminating. As the reinforcing plate, a prepreg containing glass fiber, a polyimide film, a stainless thin plate, or the like is used. The reinforcing plate will not remain in the printed-wiring board product with thin board thickness, after the shape is machined.
申请公布号 JP2001177217(A) 申请公布日期 2001.06.29
申请号 JP19990356962 申请日期 1999.12.16
申请人 NIPPON AVIONICS CO LTD 发明人 SANO SHUNJI
分类号 H05K3/02;H05K1/02;H05K3/00;H05K3/18;H05K3/22;(IPC1-7):H05K3/00 主分类号 H05K3/02
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