| 摘要 |
PROBLEM TO BE SOLVED: To provide die bonding, capable of mounting a pellet without producing large voids in a solder layer, after the pellet is mounted. SOLUTION: In a position where solder 2 is supplied, the solder 2 sent from a solder supply nozzle 3a is once melted on a solder melting part 15 and then is slipped from a slope-shaped tip end to a land portion of a lead frame 1. For this reason, the oxide film on the surface of the solder 2 is stirred well, while the solder is being slipped to prevent large voids from being produced in the solder layer after the pellet is mounted. This can reduce the rate of defective IC or LSI and increase reliability.
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