| 摘要 |
PROBLEM TO BE SOLVED: To increase the durability of a socket for inspection by allowing a low profile socket so as to reduce the size of the socket for inspection and preventing a defective contact and wear of an electrode pattern of an inspection circuit board in a socket for IC package inspection having a BGA or a PGA. SOLUTION: A plunger 1 is installed so as to be allowed to be projected and recessed in the state of being locked axially to one end of a tube 2, and energized projectedly to the BGA side by an inner coil spring 3. Also, one end of an outer coil spring 5 is allowed to abut on a flange part 2a formed on the outer periphery of the tube 2, and the other end is allowed to abut on the inside of a socket base body 11. By the outer coil spring 5, a plunger 4 attached to the other end of the tube 2 is energized projectedly to the inspection circuit board side.
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