发明名称 HEAT DISSIPATING STRUCTURE OF ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To enable an electronic part fixed on a heat dissipating plate to be enhanced in heat dissipating effect and to protect the soldered part of the electronic part against cracking. SOLUTION: A heat dissipating plate 2 is composed of a heat dissipating plate body 2a which is nearly M-shaped in cross section and composed of a center bent part 2d and two shoulder bent parts 2e, a first flat plate 2b and a second flat plate 2c which are provided integrally to the edges of the heat dissipating plate body 2a, and a pair of mounting legs 2f and 2h which are provided to the lower edges of the flat plates 2b and 2c. The heat dissipating plate 2 is mounted on the printed board 1 with the mounting legs 2f and 2h making the center bent part 2d and the two shoulder bent parts 2e nearly parallel with the printed board 1 and the flat plates 2b and 2c nearly vertical to the printed board 1, and electronic parts 3 and 4 are fixed on the first flat plate 2b and/or the second flat plate 2c.
申请公布号 JP2001177027(A) 申请公布日期 2001.06.29
申请号 JP19990360181 申请日期 1999.12.20
申请人 SHARP CORP 发明人 BASHIZAKA TOYOKI
分类号 H05K7/20;H01L23/40;(IPC1-7):H01L23/40 主分类号 H05K7/20
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