| 摘要 |
PROBLEM TO BE SOLVED: To recover from a trouble in a short time even if a hinge mechanism 3 fails in an IC socket used when an IC is tested and inspected electrically. SOLUTION: A connection mechanism 7 having a cover body 2 and allowing a hinge mechanism to be removed and installed is provided. Even if a damage of a hinge pin 3a or wear of a bearing part occurs, the hinge mechanism 3 can be replaced rapidly with a new one.
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