发明名称 |
TAPE CARRIER-TYPE SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND LIQUID CRYSTAL MODULE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To prevent a wiring pattern from being hollowed without the increase of cost even if an outer connection terminal part is gold-plated. SOLUTION: The wiring pattern 4 of a tape carrier 16 in COF 15 gold-plates 6 a part which is not filmed by solder resist 10. The inner lead 14 of the tape carrier 16 and the gold bump 3 of the electrode 2 of a semiconductor element 1 are heated and pressurized. Gold and gold are press-contacted and joined. The inner lead 14 is penetrated into the gold bump 3 so as to join them. |
申请公布号 |
JP2001176918(A) |
申请公布日期 |
2001.06.29 |
申请号 |
JP19990361633 |
申请日期 |
1999.12.20 |
申请人 |
SHARP CORP |
发明人 |
IWANE TOMOHIKO;TOYOSAWA KENJI |
分类号 |
H01L21/60;G02F1/1345;H01L23/498;H05K3/24;H05K3/32 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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