| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized substrate processor, which can prevent a substrate from being contacted with the outside air after it is processed. SOLUTION: A processor 1 for processing a wafer W has a first processing chamber 2 for storing therein the wafer W, second processing chamber 4, wafer guide 6 for moving up and down the wafer W between the first and second processing chambers 2, 4, shutter 7 for opening and closing a partition between the first and second processing chambers 2, 4, water-vapor feeding means 8 for feeding a water vapor, ozone-gas feeding means 9 for feeding an ozone gas, IPA feeding means 10 for feeding IPA, pure-water feeding means 11 for feeding a pure water, and liquid exhausting means 12 for discharging the pure water.
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