| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that poor electrical insulation or short circuit easily occurs between adjacent external lead terminals. SOLUTION: In this package for housing a semiconductor element, a plurality of external lead terminals 2 are soldered in a plurality of rows to a ceramic substrate 1 constituting a vessel for housing a semiconductor element so that the terminals 2 are projected from a lower surface of the ceramic substrate 1 at a certain repeated intervals. The certain repeated intervals are set to be narrower on the side of the lower surface of the ceramic substrate 1 with a wide portion 2a provided in the middle of the external lead terminal 2, and wider on the side of the lower end of the external lead terminal 2. Poor electrical insulation or short circuit between external lead terminals 2 can be effectively prevented while the size of the ceramic substrate 1 can be reduced.
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