| 摘要 |
PROBLEM TO BE SOLVED: To control film thickness of a conductive adhesive layer highly precisely in a manufacturing process of a semiconductor device forming conductive adhesive in a projection electrode of a semiconductor chip. SOLUTION: Film thickness is measured by means of a laser film thickness measuring instrument 4 which is kept stationary at a first portion 10 to a transfer area 5 of a conductive adhesive layer 3 formed on a transfer dish 1. Then, the instrument 4 is moved to a second portion 13 and film thickness is measured keeping it stationary at the second portion 13. When there is difference in film thickness of the conductive adhesive layer 3 measured at the first portion 10 and the second portion 13, each of micrometers 12, 15 provided to a lower part of the transfer dish 1 is adjusted and height between a bottom surface of a blade 2 and a surface of the transfer dish 1 is adjusted in a transfer area 5. As a result, it is possible to stably control film thickness readily and highly precisely by adjustment at measurement portion without measurement variation caused by movement vibration of a measuring instrument.
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