发明名称 SEMICONDUCTOR WAFER THERMAL PROCESSOR
摘要 PROBLEM TO BE SOLVED: To perform a thermal process by a thermal processor which thermally processes a semiconductor wafer without shortening the lifetime of a small number of carriers. SOLUTION: A reaction gas introducing pipe 7 is provided which introduces reaction gas into reaction pipe 11. Semiconductor wafers 12 supported by a wafer support 8 are inserted into the reaction pipe 11. A cooling gas introducing pipe 6 which blows cooling gas directly to the respective semiconductor wafer 12, and a cooling gas discharge pipe 3 for discharging the cooling introduced into the reaction pipe 11, are provided.
申请公布号 JP2001176810(A) 申请公布日期 2001.06.29
申请号 JP19990355815 申请日期 1999.12.15
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC 发明人 MINAMI SHINJI
分类号 H01L21/22;H01L21/31;(IPC1-7):H01L21/22 主分类号 H01L21/22
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