发明名称 |
SEMICONDUCTOR WAFER THERMAL PROCESSOR |
摘要 |
PROBLEM TO BE SOLVED: To perform a thermal process by a thermal processor which thermally processes a semiconductor wafer without shortening the lifetime of a small number of carriers. SOLUTION: A reaction gas introducing pipe 7 is provided which introduces reaction gas into reaction pipe 11. Semiconductor wafers 12 supported by a wafer support 8 are inserted into the reaction pipe 11. A cooling gas introducing pipe 6 which blows cooling gas directly to the respective semiconductor wafer 12, and a cooling gas discharge pipe 3 for discharging the cooling introduced into the reaction pipe 11, are provided.
|
申请公布号 |
JP2001176810(A) |
申请公布日期 |
2001.06.29 |
申请号 |
JP19990355815 |
申请日期 |
1999.12.15 |
申请人 |
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC |
发明人 |
MINAMI SHINJI |
分类号 |
H01L21/22;H01L21/31;(IPC1-7):H01L21/22 |
主分类号 |
H01L21/22 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|