| 摘要 |
A process for the preparation of composition board, particleboard, fiberboar d, waferboard and oriented strandboard as well as new and useful products thereof are provided for by the separation of one portion of the solid constituents of the composition board and the separate blending of that portion with adhesive before combining and mixing that portion with the remaining solid constituents of the composition board product. The method and product is particularly adapted to the use of fines as the one portion of the solid component board of composition board and utilizing the pre-coated fines as an adhesive carrier in the final step of mixing or blending of the fines with t he remaining composition board components. The novel process and resulting products contemplate the separation of the solid components of the composition board products by particle size so that particles of 10 to 20 mesh, 20 to 40 mesh and 40 mesh and smaller are first separated from the remaining components and then the smallest component is judiciously coated with an adhesive to function as an adhesive carrier when mixed with the remaining solid components of composition board. The novel products of the invention include fines as adhesive nuclei for binding the larger components of the composition board together and producea more uniform, cohesive and novel composition board product.
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