| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that conductive adhesive on a bump is extended and short-circuit occurs between adjacent electrodes in connection between a semiconductor element and a substrate through the bump. SOLUTION: A lower part 14a and an upper part 14b on the upper face end part are formed on an electrode pad 5 on the semiconductor element 1 as a bump 15. Thus, the sufficient amount of conductive adhesive 12 is formed especially on the upper part 14b of the bump 15. The unnecessary extension of conductive adhesive 12 to an adjacent area is prevented and a short-circuit defect can be suppressed at the time of connection to a semiconductor carrier 2. At the time of forming the upper part 14b in the end of the lower part 14a, they are arranged in a zigzag and therefore the short-circuit defect can be suppressed. |
