| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an infrared data communication module which can be lessened in size without deteriorating its performance. SOLUTION: A cup-shaped recess 4 is provided to a flexible board 2 of polyimide, an LED chip 3 is mounted in the recess 4 at its center, and a photodiode 5 and an IC chip 6 are mounted on a flat other than the recess 4. Electronic parts mounted on the flexible board 2 are sealed up with infrared transmissive resin 7, and the resin 7 is so formed as to set the positions of the LED chip 3 and the photodiode 5 corresponding to lenses 7a and 7b. In this infrared data communication module 1, the flexible board 2 as thick as 0.1 mm or so is used substituting a usual hard board of thickness 0.8 mm or so, so that the communication module 1 can be lessened in size by modifying the lenses 7a and 7b in shape without deteriorating its performance.</p> |
