发明名称 FLEXIBLE PRINTED BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a flexible printed board which has a polyimide layer, having high adhesive strength with respect to metal foil and will not curl before and after etching the metal foil. SOLUTION: In this flexible printed board provided with the polyimide layer formed by imidizing a polyamic acid varnish film formed on the metal foil, the polyimide layer has a range of coefficient of linear expansion of 10×10-6 (1/K) to 30×10-6 (1/K) and shows a softening point, at least the imidizing temperature.</p>
申请公布号 JP2001177201(A) 申请公布日期 2001.06.29
申请号 JP19990361821 申请日期 1999.12.20
申请人 SONY CHEM CORP 发明人 KUDO NORIAKI;NAGASHIMA MINORU
分类号 H05K3/38;C08G73/10;H05K1/03;(IPC1-7):H05K1/03 主分类号 H05K3/38
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