| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting structure of a semiconductor element, which can mount the semiconductor element in a satisfactory state. SOLUTION: In the mounting structure of the semiconductor element, an insulating substrate 1 to which circuit wiring 2 is stuck and the semiconductor element 6 having plural terminals 7 on a lower face are installed and the terminals 7 of the semiconductor element 6 are solder-joined (solder: 8) to circuit wiring 2 on insulating substrate 1 so as to electrically connect them. Circuit wiring 2 is constituted of aluminium and a zinc-copper plated layer 3, a nickel plated layer 4, and a gold plated layer 5 are sequentially stuck to the solder joining part of circuit wiring 2. |
