| 摘要 |
<p>An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the top surface thereof where the solder pads contain no more than about 20 weight percent in tin and has a reflow temperature of no greater than about 270 °C.</p> |
