ORGANIC FLIP CHIP PACKAGES WITH AN ARRAY OF THROUGH HOLE PINS

摘要

An organic carrier member for mounting a semiconductor device is provided that has a plurality of pin leads joined to conductive pads by an internal conductive layer. The pin leads are embedded in the organic carrier member and joined to the conductive layer by a solder alloy having a reflow temperature higher than the temperature necessary to attach the semiconductor device. Embodiments include a bismaleimide-triazine epoxy laminate carrier member having an array of pins joined to the carrier member by a solder alloys having a reflow temperature of about 220 DEG C to about 270 DEG C.