METHOD AND APPARATUS FOR PACKAGING HIGH FREQUENCY COMPONENTS

摘要

The invention provides a method and apparatus for packaging high frequency electrical and/or electro-optical components. The package (140) may be surface mounted on a board with other electrical components. The shielding provided by the package minimizes electromagnetic interference with other electrical components on the board. The package includes a controlled impedance I/O interface for coupling with the electrical or electro-optical components in the package. The interface may also include a differential I/O capability to further control electromagnetic fields generated at the interface. Additionally, the package may include an optical link provided by one or more optical fibers (150) extending from the package. These features allow the package to be used for a variety of high frequency components including optical transmitters (254) and optical receivers. A method for fabricating the package is also disclosed. The package may be fabricated with relatively low cost and a reduced form factor as compared with prior art packages.