| 摘要 |
A semiconductor non-volatile memory device that includes memory cells and selection transistors. The memory cells each include a floating gate transistor having an active area, source and drain regions, a floating gate, and a control gate, and each of the floating gate transistors is serially coupled to one of the selection transistors. A contact to the control gate is located above the active area. In a preferred embodiment, the contact is substantially aligned with a central portion of the active area. A method for manufacturing a non-volatile memory device on a semiconductor substrate is also provided. According to the method, a poly1 layer is deposited, an interpoly dielectric layer is deposited above the poly1 layer, and a poly2 layer is deposited above the interpoly dielectric layer. A mask is provided to define the control gate, and a Self-Aligned poly2/interpoly/poly1 stack etching is used to define a gate stack structure that includes the control gate and the floating gate. The floating gate is defined using only the mask and the Self-Aligned poly2/interpoly/poly1 stack etching. In one preferred method, a contact to the control gate is formed above the active area.
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