发明名称 |
FORMING INTERCONNECTS |
摘要 |
A method for forming an electronic device, comprising: forming a first conductive or semiconductive layer; forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer; locally depositing solvents at a localis ed region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through th e sequence of layers; and depositing conductive or semiconductive material in the void.
|
申请公布号 |
CA2394895(A1) |
申请公布日期 |
2001.06.28 |
申请号 |
CA20002394895 |
申请日期 |
2000.12.21 |
申请人 |
PLASTIC LOGIC LIMITED |
发明人 |
FRIEND, RICHARD HENRY;KAWASE, TAKEO;SIRRINGHAUS, HENNING |
分类号 |
H01L21/288;H01L21/311;H01L21/312;H01L21/336;H01L21/768;H01L27/32;H01L29/786;H01L51/00;H01L51/05;H01L51/40;H01L51/52;(IPC1-7):H01L51/40 |
主分类号 |
H01L21/288 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|