HIGH SPEED ELECTRONIC ASSEMBLY SYSTEM AND METHOD

摘要

Aspects of the present invention are directed to methods and apparatus for producing substrates, a production system having printed circuit boards, in production lines. In one aspect, the present invention provides a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use in production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.