发明名称 METHOD OF PACKAGING A THERMOPLASTIC COMPOSITION WITH A FILM HAVING A LOW COMPLEX VISCOSITY AND CORRESPONDING PACKAGED ARTICLE
摘要 <p>The present inventors have discovered that an easily measured property, namely complex viscosity, directly relates to physical film compatibility and have further identified a class of polyolefin materials, which are particularly amenable to exhibiting such properties. It is important to note that this discovery assumes that the film material is first chemically compatible with the thermoplastic composition to be packaged. The invention is particularly useful for low viscosity thermoplastic compositions having a Brookfield viscosity of less than about 10,000 cPs at 350 °F, such as pressure sensitive hot melt adhesive compositions which are typically applied by melting the package adhesive composition in a melt tank wherein the melt tank lacks an active mixing means. The invention is also useful for hot melt adhesives that are applied by application means that are very sensitive to inhomogeneity of the combination of molten hot melt adhesive and molten packaging material such as spraying, screen printing, foaming and gravure coating hot melt application techniques.</p>
申请公布号 WO2001046019(A1) 申请公布日期 2001.06.28
申请号 US1999030482 申请日期 1999.12.21
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