发明名称 |
Circuit module and method for mounting the same |
摘要 |
A circuit module has a covering member which has a plate portion and one or more supporting portions and a circuit board on which electronic components are mounted. The supporting portions fix the plate portion parallel to the surface of the circuit board. The covering member can be chucked by a chucking device to mount the circuit module to a mother circuit board.
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申请公布号 |
US2001004941(A1) |
申请公布日期 |
2001.06.28 |
申请号 |
US20000736062 |
申请日期 |
2000.12.13 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
INOUE KEIJI;ISHIGE TSUTOMU;OHTA YOSHITERU |
分类号 |
H01F27/02;H02M3/28;H05K1/14;H05K1/16;H05K1/18;H05K3/30;H05K7/02;(IPC1-7):H05K7/02 |
主分类号 |
H01F27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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