发明名称 Circuit module and method for mounting the same
摘要 A circuit module has a covering member which has a plate portion and one or more supporting portions and a circuit board on which electronic components are mounted. The supporting portions fix the plate portion parallel to the surface of the circuit board. The covering member can be chucked by a chucking device to mount the circuit module to a mother circuit board.
申请公布号 US2001004941(A1) 申请公布日期 2001.06.28
申请号 US20000736062 申请日期 2000.12.13
申请人 MURATA MANUFACTURING CO., LTD. 发明人 INOUE KEIJI;ISHIGE TSUTOMU;OHTA YOSHITERU
分类号 H01F27/02;H02M3/28;H05K1/14;H05K1/16;H05K1/18;H05K3/30;H05K7/02;(IPC1-7):H05K7/02 主分类号 H01F27/02
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