Method for fabricating semiconductor device

摘要

The present invention discloses a method for fabricating a semiconductor device. In a process for forming metal interconnection contact holes on both a gate electrode including an Si-rich SiON film as a mask insulating film in a peripheral circuit region and on a semiconductor substrate, the metal interconnection contact hole is formed according to a three-step etching process using a photoresist film pattern exposing the intended locations of a metal interconnection contacts as an etching mask. Accordingly, contact properties are improved by preventing damage to the semiconductor substrate, thereby reducing leakage current and improving yield.