Leistungsverpackung mit hoher Zuverlässigkeit für eine elektronische Halbleiterschaltung

摘要

A chip package of the type incorporating in a body shell of synthetic plastic material (2) at least one integrated electronic circuit and semiconductor chip (3) mounted on a chip support frame (4) and a heat dissipating device (5) in contact with said chip (3) provides that the heat dissipating device (5) have at least two structurally independent heat dissipating elements (15,16) in mutual contact. The two heat dissipating elements (15,16) are located on opposite sides of said support frame (4) and arranged symmetrically in relation to said frame (4). In addition, said heat dissipating elements (15,16) are interconnected in a separable manner by self-centring spacing posts (12,13).