| 发明名称 |
Interposer assembly |
| 摘要 |
<p>An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts loosely confined in the passages. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members. <IMAGE></p> |
| 申请公布号 |
EP1111977(A1) |
申请公布日期 |
2001.06.27 |
| 申请号 |
EP20010104395 |
申请日期 |
1998.10.27 |
| 申请人 |
INTERCON SYSTEMS, INC. |
发明人 |
NEIDICH, DOUGLAS A.;WALDEN, JOHN D. |
| 分类号 |
H01R12/00;H01R12/70;H01R12/71;H01R13/24;H05K7/10;(IPC1-7):H05K7/10 |
主分类号 |
H01R12/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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