发明名称 |
Processes and compositions for electroless metallization |
摘要 |
<p>Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.</p> |
申请公布号 |
EP0510711(B1) |
申请公布日期 |
2001.06.27 |
申请号 |
EP19920107141 |
申请日期 |
1992.04.27 |
申请人 |
CALVERT, JEFFREY M.;DRESSICK, WALTER J.;CALABRESE, GARY S.;GULLA, MICHAEL |
发明人 |
CALVERT, JEFFREY M.;DRESSICK, WALTER J.;CALABRESE, GARY S.;GULLA, MICHAEL |
分类号 |
C23C18/18;C23C18/16;C23C18/20;C23C18/28;H05K3/18;H05K3/42;(IPC1-7):C23C18/20 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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