| 摘要 |
PURPOSE: A lead frame for semiconductor package is provided to reduce the number of inferior semiconductor by removing partially an edge of a pad connected with a support bar and changing the length of support bar to a pad area. CONSTITUTION: A semiconductor chip is contacted with a rectangular pad(11) of a lead frame. An edge of the rectangular pad(11) is connected with a strip of the lead frame by each support bar(12,13). Each edge of the rectangular pad(11) can be supported by each support bar. The remaining area(27) of the rectangular pad(11) except for an area contacted with each support bar(12,13) is removed. The remaining area(27) is used as a part of the support bars(12,13). Each practical length of support bar(12,13) is lengthened as much as the length of the edge area of the pad.
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